لوحات الدوائر المطبوعة المرنة والصلبة
Flex PCB, also known as FPC (flexible printed circuit board), is a circuit board which utilizes plastic substrates, like polyimide or polyester films, to create a flexibly and durable material for assembling components. FPC can be connection points or the primary control board of a PCB assembly.
Rigid-Flex PCB combines the features of rigid and flexible into one PCB. The rigid portion provides durability and the flexible section provides light weight a thin profile for various applications.
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Flexible Printed Circuit (الشركة العامة للفوسفات)
Flexible printed circuit consists of conducting layers made of copper foil and insulating layers dielectric that are typically laminate together with polyimide / PET / PEN / Liquid Crystal Polymer (LCP).
The board is used as a substrate for assembling electronics devices and can be bent for specific applications.
Single Side FPC
- Consists of a single conductor layer of metal or conductive polymer on a flexible dielectric film.
- Component termination features are accessible only from one side, with holes in the base film for component assembly.

Double Side FPC
- Consists of 2 conductive layers fabricated with or without plated through holes.
- When constructed without plated through hole, the connection features are accessible only from one side.
- Because of the plated through hole, terminators for electronics components are provided on both sides of the circuit, allowing components to be placed on either side.

Multi Layered Flex Circuit
- Consists of 3 or more layers of conductive and are also known as multilayer flex circuit.
- Layers are interconnected by plated through hole or openings to access lower circuit level features.
- Discontinuous lamination is common in cases that require maximum flexibility or bending.

Bare Backed Flex Circuit
- Bare Back Flex Circuit (double access) has a single conductor layer that allows access to features of the conductor pattern such as lead termination from both sides.
- This is not commonly manufactured because of the special processing required to provide access to the features discretely.

Rigid Flex Circuit
- Hybrid constructions consists of flexible and rigid substrates are laminated together into a single structure and then electrically interconnected using plated through hole.


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We strictly check and control the shipment quality according to the international standards and customer standards, timely follow up the product quality performance after shipment, and take quick and effective improvement actions on the customer


| غرض | مواصفة | Comments | |
| Layer counts | Flexible PCB | 1-10 Layers | |
| Rigid-Flex PCB | 2-16 Layers | ||
| HDI PCB | 2+N+2 Layers | ||
| Copper Thickness | 6um min | ||
| 4OZ max | |||
| PNL Size(maximum) | 610*914مم | ||
| Hole Diameter | Laser drilling | 0.05mm min | |
| Mechanical drilling | 0.15mm min | ||
| Hard tooling Hole | 0.50مم | ||
| Aspect Ratio(maximum) | Through hole | 10:1 | |
| Blind hole | 2:1 | ||
| Line (minimum) | 1/3oz Copper | 1.2ميل | LDI |
| 0.5oz Copper | 1.5ميل | ||
| 0.5oz Copper | 2ميل | Film exposure | |
| 1oz Copper | 3ميل | ||
| 2oz Copper | 4ميل | ||
| البعد&Tolerances | Hole Size | ± 0.05 ملم | H≦2.0mm |
| Line | ±10% | W≧0.25mm | |
| Accumulate tolerance | ± 0.05 ملم | W<0.25مم | |
| Line to outline | ± 0.05 ملم | P≦25mm | |
| Outline tolerance | ± 0.05 ملم | C≦5.0mm | |
| Impedance tolerance | ±10% | ||
| Connectivity test | Resistance(minimum) | 0.5MΩ | Four lines |
| Resistance(minimum) | 5أوه | Ordinary | |
| Insulation Resistance | 50MΩ | Ordinary | |











