PAPAN SIRKUIT CETAK KAKU
Rigid circuit board is the most common and primary electronic component to a PCB assembly. Rigid PCB can be manufactured into single layer, double layers and multi-layer designs. There are also a wide range of materials which they can be manufactured with low cost to high technology.
Availbe for Production Order, Hot Order, Qucik Turn PCBS: Small volume prototype, Quick-turn pre-production circuit boards，Production quick-turn circuit boards
- Keterangan
- Parameter
Keterangan
Rigid PCB
Rigid PCB circuit consists of conducting layers made of copper foil and insulating layers dielectric that are typically laminated together with epoxy resin prepreg. The board is typically coated with solder mask.
We build thousands of different products for our customers across a wide range of technologies and applications.
Kemampuan teknologi kami mencakup lebih dari itu 90% dari semua teknologi PCB. Dinyatakan secara sederhana, kita dapat membuat hampir semua PCB dengan baik.
Surface Finishes
Kualitas Luar Biasa
- Kontrol Kualitas Masuk
Kami menggunakan bahan baku dari merk ternama, telah menetapkan peraturan inspeksi material masuk yang mematuhi standar internasional dan pelanggan, terus-menerus melacak dan mempromosikan kegiatan peningkatan kualitas pemasok, dan membangun serta memelihara kerja sama yang kuat dengan pemasok.
- Kontrol kualitas proses
Proses produksi terstandarisasi dan instruksi pengoperasian terperinci untuk setiap proses lini produksi untuk memastikan bahwa spesifikasi pengoperasian dan standar pengoperasian diterapkan dengan benar.
- Kontrol kualitas produk jadi
Kami secara ketat memeriksa dan mengontrol kualitas pengiriman sesuai dengan standar internasional dan standar pelanggan, menindaklanjuti kinerja kualitas produk secara tepat waktu setelah pengiriman, dan mengambil tindakan perbaikan yang cepat dan efektif terhadap pelanggan
| Fitur | Parameter | |
| Lapisan | 1 – 36L | |
| Max Board Size | 580 x 1080mm, advanced 610 x 1400mm | |
| Board Thickness Range | 0.40 – 7.0mm | |
| Copper weight | 18 – 210μm, advanced 1050μm / 30oz | |
| Min Line Width /Space | 2.5 juta / 2.5 juta | |
| Minimum mechanical drill | 0.20 mm | |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced | |
| PTH Wall Thickness | 1 juta | |
| PTH Dia. Tolerance | ± 3 juta | |
| NPTH hole Dia. Tolerance | ± 2 juta | |
| Hole Position Deviation | ±2 mil | |
| Layer Registration | ≥ 4mil | |
| Outline Tolerance | ± 4 juta | |
| S/M Pitch | 3 juta | |
| Aspect Ratio | 18:1 | |
| Warp & Twist | ≤0.7% | |
| Solder Mask Abrasion | ≥ 6H | |
| Flammability | 94V-0 | |
| Impedance Control | Diff >50ohm | +/- 10% |
| Single-end ≤50 ohm | +/- 8% | |
| HDI Capability | Any Layer | |
| Dimple | 20um, 10um advanced | |
| Back Drill Size min | 0.40mm | |
| Special Technology | POFV | Ya |
| Hybrid Lamination | Ya | |
| Metallized half hole | Ya | |
