Penguji Suhu Tungku KIC 2000

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Simplified temperature curve testing steps

By simplifying complex process settings through automated processes, SlimKIC 2000 makes temperature curve testing exceptionally simple, allowing any operator to quickly achieve good process settings. Simply define the process window automatically from the temperature curve specifications of a hundred commonly used solder paste suppliers, and the color code signal will alert the operator when it does not meet the requirements

Accelerate the testing process of temperature curves

Innovative technology has been adopted to eliminate the tedious task of measuring temperature curves using traditional methods. The measurement of products in various areas of the reflow soldering furnace and thermocouples has been automated. The acceptability of the process curve can be determined in real-time, reducing the required number of temperature curve tests and reducing production downtime.

More accurate temperature curve testing

SlimKIC 2000 simplifies the process to a single number – Process window indexTM (PWI), allowing you to accurately understand the degree of completeness of the temperature curve. The simplified user interface can guide the operator to complete the entire temperature curve testing process, greatly reducing incorrect temperature settings of the reflow soldering furnace and various defects that affect production.

Temperature curve testing is easier

Even for complex products and requirements, SlimKIC 2000 can make process settings effortless, including narrow process windows caused by lead-free regulations, eliminating the hassle of lead-free transitions during temperature curve testing, and improving product quality and reliability.