PAPAN LITAR BERCETAK TEGAR
Rigid circuit board is the most common and primary electronic component to a PCB assembly. Rigid PCB can be manufactured into single layer, double layers and multi-layer designs. There are also a wide range of materials which they can be manufactured with low cost to high technology.
Availbe for Production Order, Hot Order, Qucik Turn PCBS: Small volume prototype, Quick-turn pre-production circuit boards，Production quick-turn circuit boards
- Penerangan
- PARAMETER
Penerangan
Rigid PCB
Rigid PCB circuit consists of conducting layers made of copper foil and insulating layers dielectric that are typically laminated together with epoxy resin prepreg. The board is typically coated with solder mask.
We build thousands of different products for our customers across a wide range of technologies and applications.
Keupayaan teknologi kami meliputi lebih 90% daripada semua teknologi PCB. Secara ringkasnya, kita boleh membina hampir mana-mana PCB dengan baik.
Surface Finishes
Kualiti Cemerlang
- Kawalan Kualiti Masuk
Kami menggunakan bahan mentah daripada jenama terkenal, telah menetapkan peraturan pemeriksaan bahan masuk yang mematuhi piawaian antarabangsa dan pelanggan, sentiasa mengesan dan mempromosikan aktiviti peningkatan kualiti pembekal, dan membina serta mengekalkan kerjasama yang kukuh dengan pembekal.
- Kawalan kualiti proses
Proses pengeluaran piawai dan arahan operasi terperinci untuk setiap proses barisan pengeluaran untuk memastikan spesifikasi operasi dan piawaian operasi dilaksanakan dengan betul.
- Kawalan kualiti produk siap
Kami dengan ketat menyemak dan mengawal kualiti penghantaran mengikut piawaian antarabangsa dan piawaian pelanggan, susulan tepat pada masanya prestasi kualiti produk selepas penghantaran, dan mengambil tindakan penambahbaikan yang cepat dan berkesan ke atas pelanggan
| Feature | Parameter | |
| Lapisan | 1 – 36L | |
| Max Board Size | 580 x 1080mm, advanced 610 x 1400mm | |
| Board Thickness Range | 0.40 – 7.0mm | |
| Copper weight | 18 – 210μm, advanced 1050μm / 30oz | |
| Min Line Width /Space | 2.5 mil / 2.5 mil | |
| Minimum mechanical drill | 0.20 mm | |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced | |
| PTH Wall Thickness | 1 mil | |
| PTH Dia. Tolerance | ± 3 mil | |
| NPTH hole Dia. Tolerance | ± 2 mil | |
| Hole Position Deviation | ±2 mil | |
| Layer Registration | ≥ 4mil | |
| Outline Tolerance | ± 4 mil | |
| S/M Pitch | 3 mil | |
| Nisbah Aspek | 18:1 | |
| Warp & Twist | ≤0.7% | |
| Solder Mask Abrasion | ≥ 6H | |
| Flammability | 94V-0 | |
| Impedance Control | Diff >50ohm | +/- 10% |
| Single-end ≤50 ohm | +/- 8% | |
| HDI Capability | Any Layer | |
| Dimple | 20satu, 10um advanced | |
| Back Drill Size min | 0.40mm | |
| Special Technology | POFV | Ya |
| Hybrid Lamination | Ya | |
| Metallized half hole | Ya | |
