Ultra-Large board online 3D solder paste inspection- LSPI Series

Full 3D detection is efficient, fast and stable

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Description

PROGRAMMABLE STRUCTURED GRATING PMP IMAGING TECHNOLOGY

Phase modulation profiling technology (PMP) is used to achieve three-dimensional measurement of printed solder paste, which can greatly improve measurement accuracy while ensuring high-speed inspection.

ACTIVE RGB 2D LIGHT SOURCE、2D LIGHTING SOURCES

Patented RGB Tune function takes Red, Green and Blue images and with unique filter algorism, to solve solder bridge detection false alarm and relative zero surface uncertain issue. In the mean time, provide the 2D/3D measurements and image of printed solder paste. operate with 2D lighting sources avoids problems caused by the angle of the red RGB color distortion effect in solder; RGB tuning in Different PCB colors is more versatile ; Fulfill a variety of dispensing process testing ; greatly improve the equipment ( height ,volume , area ) epeatability accuracy

HIGH RESOLUTION AND HIGH FRAME RATE IMAGE PROCESSING UNIT

It provides a variety of detection accuracy of 2.8μm,4.5μm,5μm,7μm,8μm,10μm,12μm,15μm,18μm,20μm etc. It meets the customer’s requirements for product diversity and detection speed.

Z-AXIS DYNAMIC COMPENSATION + TELECENTRIC LENS STATIC COMPENSATION

Solves the problem of ordinary lens, squint and deformation by using high-cost telecentric lens and special software test algorithm, which greatly enhances the inspection accuracy and inspection ability. Achieves the industry’s leading static compensation for FPC warping.

HIGH-PRECISION INTEGRATED CONTROL PLATFORM

High rigid grade steel combines with close loop servo control and high precision level ball screw makes high speed and steady positioning. Optional linear and high precision linear encode positioning system is capable measure 03015 device pad with ultra high resolution and high speed. The repeatable accuracy can down to 1 um.

FIDUCIAL MARK POINT IDENTIFICATION, BAD MARK INSPECTION, CLOSED-LOOP CONTROL

Automatically identify fiducial mark and bad marks, share real-time close-loop inspection data to printers and mounters. Ensure printers and mounters are tuned in real time.

5 MINUTES PROGRAMMING AND ONE PRESS OPERATION

Engineers with any levels of experience can independently program the system quickly and accurately through Gerber importing software module and the friendly programming interface. One-button operation by the operator is designed also greatly reduces the requirements for training.

POWERFUL PROCESS ANALYSIS (SPC)

Real-time SPC information display,provides powerful quality control to the users. Complete variety of SPC tools, are aviable for users at a glance.

 

APPLICATION OF 3DSPI IN THE FIELD OF HIGH DENSE SOLDER PASTE PRINTING INSPECTION

MiniLED and MicroLED are composed of small LED lights. The number of small LEDs on a single board can reach more than 1 million pads. The size of a single unit of MiniLED is about 100-200μm, while the size of a single unit of MicroLED can be 50μm; therefore, the 3DSPI equipment used in high-dense products uses the highest configuration in the industry; especially the use of marble platforms, linear motors and linear encoder to ensure the movement accuracy of small-sized pads. Using the industry’s leading 1.8μm resolution telecentric lens and optimizing Gerber conversion, Load Job, algorithm, data storage and query, etc., the accuracy, speed and efficiency of inspection are greatly improved.

 

APPLICATION OF 3DSPI IN THE FIELD OF ULTRA-LARGE BOARDS.

The high-quality SMT inspection requirements for ultra-large boards in automotive electronics and LED large screens can no longer meet actual production needs through manual inspection. The application of Sinictek ultra-large board SPI can solve the needs of in line ultra-large board 1200-2000MM inspection. Achieve efficient, fast and stable inspection.

Technology Platform Large platform
Model LSPI-12 LSPI-12P LSPI-15P LSPI-20P
Measurement Tech 3D white light PSLM PMP(Programmable Spatial Light Modulation,Phase Measurement Profilometry)
Measurements Volume, acreage,height, XY offset, shape
Detection of Non-Performing Types missing print,insufficient tin,excessive tin,bridging,offset,mal-shapes,surface contamination
Lens Resolution 4.5μm/5μm/6μm/8μm/10μm/12μm/15μm/16μm/18μm/20μm
Accuracy XY (Resolution):10μm
Repeatability height:≤1μm, (4Sigma); volume/area:<1%(4Sigma);
Gage R&R <10%
Inspection Speed 0.35sec/FOV-0.5sec/FOV ( According to the actual configuration)
Quanlity of Inspection Head Standard 1,option 2,3
Mark-point Detection Time 0.3sec/piece
Maximun Meauring Head ±550μm(±1200μm as option)
Maximun Measuring Height of PCB Warp ±5mm
Minimun Pad Spacing 100μm
Minimum Component 0201
Maximun Detection Size 1200x650mm 1200x650mm 1500x500mm 2000×500 mm
Conveyor Setup front orbit(back orbit as option)
PCB Transfer Direction Left to right or Right to left
Conveyor Width Adjustment manual&automatic
SPC Statistics Histogram; Xbar-R Chart; Xbar-S Chart; CP&CPK; %Gage Repartability Data; SPI Daily/Weekly/Monthly Reports
Gerber&CAD Data Import support Gerber format(274x,274d),manual Teach model);CADX/Y,Part No.,Package Type imput
Operating System Support Windows 10 Professional (64 bit)
Equipment Diemension 1900x1320x1480mm 1780x1450x1530mm 2120x1320x1530 2620x1450x1530
Weight 1250KG 1630KG 1750KG 2100KG
Optional Ablesmt One person controls more machines、Network SPC(Software only) continuous power supply
1D/2D Barcode scanner, off-line programming software,UPS