Equipamento de inspeção por raios X em linha- XI8
- High performance High definition High resolution;
- Mainly used in Semiconductor, Substrate, Lead Frame & Wire Bonding Inspection
- Package type：W/B、CI、F/C…
- Defect type：Void、Open、Short、Sweep、Solder ball…
- Descrição
- Especificação
Descrição
Function Features
- 2um closed tube,high resolution
- UPH>50K
- NG Laser marking
- Automatic inspection
- Magazine loader and unloader
- SPC chart and CPK&GRR
Aplicativo
Checking Ability
| Void under Die | Solder bridge | Sagging Wire |
| Insufficient Glue | Smashed / Broken Wire | Distorted Wire |
| Die placement | Missing Wire | Lifted Stitch /Wedge |
| Solder ball Void | Malformed Ball | Stray Wire |
| Excess Solder ball | Lifted Ball | NSOB(Non-stick on Bump) |
| Insufficient Solder | Bond | Tailing At Bump |
Inspection Hidden BGA Flaws
| Model XI-8 Summary | |
| Dimensão | 2200(C)×1250(D)×1960(H)milímetros |
| Machine Weight | 2700 kg |
| Fonte de alimentação | AC 110/220V, 50/60H |
| Poder | 6.5 kW |
| X-Ray Tube | |
| Tube Type | Seale |
| Voltagem | 40~110kV (Ajustável) |
| Current | 200 μA |
| Focus Spot Size | 2 μm |
| Imaging System | |
| Detector | Flat Panel Detector (FPD) |
| Effective Detection Area | 116.4*145.7milímetros |
| Pixel Matrix | 2352*2944 |
| Pixel Size | 49.5 μm |
| Motion Control System | |
| Movement Control | Keypad & Mouse |
| Máx. Loading Area | 310*110milímetros |
| Máx. Inspection Area | 270*100milímetros |
| Industrial PC | |
| Monitor | 24’’ FHD Interactive Touch LCD Display |
| System OS | Windows 10 64bit |
| Hard disk | 1TB |
| RAM | 8GB |
| CPU model | Intel i7 Processor |
| Other Features | |
| Door Open | Electric Sliding |
| Authority Management | Fingerprint Access Management System, and Support Password Accessing. |
| X-Ray Safety | <1μSv/h (Meets All International Standards) |
| Safety Operation | Electromagnetic Interlock, Warning Light and Real-time Radiation Leakage Monitor |
