Mesin Bongkar Muat BGA
This equipment mainly used before semiconductor packaging and testing,or before washing line,to transfer the BGA to the next station through the magazine storage method, and with automatic feeding function.
- Keterangan
- Spesifikasi
Keterangan
Fitur:
- The control system adopts PLC control
- Pengontrol layar sentuh, mudah dioperasikan
- Feeding by stepping motor
- Lifting and translation by stepping motor, can set the space easily
- Can load board by sigle magazine multiple magazines at the same time
- Mechanical clamping type for postion,can adjust arbitrarily for different size magazines
- Equipped with standard SMEMA communication port, which can communicate with other automation equipment
| Jenis | Model | Dimensi (mm) | PCB SIZE(mm) | Magazine Szie(L*W*H,MM) | Berat | Ketebalan PCB |
| BGA Loader | BL-330 | 1175*1000*1080 | 80*50-330*120 | 50*80*100-300*150*400 | 240kg | 0.2mm-2.0mm |
| BGA Unloader | BU-330 | 1175*1000*1080 | 80*50-330*120 | 50*80*100-300*150*400 | 245kg | 0.2mm-2.0mm |
| Barang | Parameter Teknis |
| Time of loading board | 6-16 second (or per customized) |
| Ketinggian Transportasi | 900±20mm(Atau disesuaikan) |
| Arah Transportasi | Dari kiri ke kanan atau kanan ke kiri |
| Sumber Udara | 4-6 bar, can up to 10 liters per minute |
| Catu daya | AC:220±10V,50/60Hz ,450W |



















