Mesin Bongkar Muat BGA

This equipment mainly used before semiconductor packaging and testing,or before washing line,to transfer the BGA to the next station through the magazine storage method, and with automatic feeding function.

Keterangan

Fitur:

  • The control system adopts PLC control
  • Pengontrol layar sentuh, mudah dioperasikan
  • Feeding by stepping motor
  • Lifting and translation by stepping motor, can set the space easily
  • Can load board by sigle magazine multiple magazines at the same time
  • Mechanical clamping type for postion,can adjust arbitrarily for different size magazines
  • Equipped with standard SMEMA communication port, which can communicate with other automation equipment

 

Jenis Model Dimensi (mm) PCB SIZE(mm) Magazine Szie(L*W*H,MM) Berat Ketebalan PCB
BGA Loader BL-330 1175*1000*1080 80*50-330*120 50*80*100-300*150*400 240kg 0.2mm-2.0mm
BGA Unloader BU-330 1175*1000*1080 80*50-330*120 50*80*100-300*150*400 245kg 0.2mm-2.0mm
Barang Parameter Teknis
Time of loading board 6-16 second (or per customized)
Ketinggian Transportasi 900±20mm(Atau disesuaikan)
Arah Transportasi Dari kiri ke kanan atau kanan ke kiri
Sumber Udara 4-6 bar, can up to 10 liters per minute
Catu daya AC:220±10V,50/60Hz ,450W