자동 고속 정밀 접착제 디스펜서 기계 GDM-900, LED 렌즈 스프레이

LED 렌즈에 널리 사용됨, 렌즈, TV 백라이트 스트립, 완전 자동 고속 표면 실장 디스펜싱, 가장자리 포장, 표면 포장, UV 접착제 디스펜싱, 에폭시 적색 접착제 디스펜싱, 바닥 충전 및 기타 공정.

  • 고속 분사 밸브 제트 적용
  • CCD 비전 시스템 자동 포지셔닝
  • 높은 안정성, 고속 디스펜싱 효과
  • 디스펜싱 지점의 일관성을 보장하는 정밀한 접착제 제어

설명

제품 기능:

  • Stable professional control software makes the dispensing process more perfect.
  • Servo motor + high-precision grinding silent screw, to ensure high speed, high precision and high consistency of movement.
  • Industrial CCD vision positioning system.
  • Simple and easy-to-use programming interface, supports CAD graphics import and track preview.
  • 모듈 식 디자인, daily cleaning and maintenance are simple and convenient.

 

Integrated welding frame:

Strong rigidity and high stability, reduces the vibration of the machine under high-speed operation, and ensures production stability.

Modular structure design:

The imported parts ensure high-speed,high-precision operation of the machine, high-efficiency production.

Non-contact high-speed injection valve:

High precisionhigh repeatability,최대 200 points per second ultra-high dispensing speedcan handle a variety of commonly used glue.

비접촉식 고속 제트 디스펜싱 밸브:

Can spray epoxy, UV, silicone, acrylic, conductive adhesive and other commonly used glue, suitable for applications requiring high-speed non-contact dispensing, such as Flip-chip and BGA under fill , Die Attach Epoxy for chip mounting, Conformal Coating for SMT components, Lens Fixing for camera modulesEncapsulation, and Surface Mounted Package , Fingerprint sensor application (Fingerprint sensor)

The Valve Character:

  • Non- contact dispensing tech
  • Super high-speed dispensing, 최대 300 points/second
  • Minimum glue dot size: 200 u m
  • Precise and precise dispensing
  • Easy to clean and maintain
  • Improved design greatly prolongs the service life of valves and consumables
  • Ultra-low use cost
Valve Dimensions 76mmx59mmx130mm(LxDxH)
무게 0.6 kg
Maximum dispensing speed 300 points per second
Minimum point diameter 200μm
Nozzle diameter 0.05mm 에 0.6 mm
공기압 최소.0.6Mpe
Maximum heating temperature 100°씨
Automatic High Speed Precision Glue Dispenser Machine GDM-900 Technical parameters
모델 GDM-900
최대 장착 면적 900mm x500mm
PCB 두께 0.8mm~6mm
Maximum board weight 5kg
Board margin gap Configuration to 4mm
Maximum bottom clearance 20mm
Transport speed 1200밀리미터/초(맥스)
Transport height 900±40mm
PCB clamping system Clamping on both sides
Field of View (FOV) 12mm x12mm
axis positioning accuracy X Y:±20um@3σ; 지:±10um@3σ
위치 정확도 XY:±10.0μm @3σ; 지:±5um@3 σ
Maximum acceleration 1200밀리미터/초 (X /Y)
Drive system Servo +motor (X Y Z)
공기의 압력 0.5-0.8MPa
차원 L1400*W1400*H1450mm
무게 800킬로그램
220V 50/60Hz, 8에이