자동 고속 정밀 접착제 디스펜서 기계 GDM-900, LED 렌즈 스프레이
LED 렌즈에 널리 사용됨, 렌즈, TV 백라이트 스트립, 완전 자동 고속 표면 실장 디스펜싱, 가장자리 포장, 표면 포장, UV 접착제 디스펜싱, 에폭시 적색 접착제 디스펜싱, 바닥 충전 및 기타 공정.
- 고속 분사 밸브 제트 적용
- CCD 비전 시스템 자동 포지셔닝
- 높은 안정성, 고속 디스펜싱 효과
- 디스펜싱 지점의 일관성을 보장하는 정밀한 접착제 제어
- 설명
- 사양
- 동영상
설명
제품 기능:
- Stable professional control software makes the dispensing process more perfect.
- Servo motor + high-precision grinding silent screw, to ensure high speed, high precision and high consistency of movement.
- Industrial CCD vision positioning system.
- Simple and easy-to-use programming interface, supports CAD graphics import and track preview.
- 모듈 식 디자인, daily cleaning and maintenance are simple and convenient.
Integrated welding frame:
Strong rigidity and high stability, reduces the vibration of the machine under high-speed operation, and ensures production stability.

Modular structure design:
The imported parts ensure high-speed,high-precision operation of the machine, high-efficiency production.

Non-contact high-speed injection valve:
High precision,high repeatability,최대 200 points per second ultra-high dispensing speed,can handle a variety of commonly used glue.

비접촉식 고속 제트 디스펜싱 밸브:
Can spray epoxy, UV, silicone, acrylic, conductive adhesive and other commonly used glue, suitable for applications requiring high-speed non-contact dispensing, such as Flip-chip and BGA under fill , Die Attach Epoxy for chip mounting, Conformal Coating for SMT components, Lens Fixing for camera modules,Encapsulation, and Surface Mounted Package , Fingerprint sensor application (Fingerprint sensor)
The Valve Character:
- Non- contact dispensing tech
- Super high-speed dispensing, 최대 300 points/second
- Minimum glue dot size: 200 u m
- Precise and precise dispensing
- Easy to clean and maintain
- Improved design greatly prolongs the service life of valves and consumables
- Ultra-low use cost
| Valve Dimensions | 76mmx59mmx130mm(LxDxH) |
| 무게 | 0.6 kg |
| Maximum dispensing speed | 300 points per second |
| Minimum point diameter | 200μm |
| Nozzle diameter | 0.05mm 에 0.6 mm |
| 공기압 | 최소.0.6Mpe |
| Maximum heating temperature | 100°씨 |
| Automatic High Speed Precision Glue Dispenser Machine GDM-900 Technical parameters | |
| 모델 | GDM-900 |
| 최대 장착 면적 | 900mm x500mm |
| PCB 두께 | 0.8mm~6mm |
| Maximum board weight | 5kg |
| Board margin gap | Configuration to 4mm |
| Maximum bottom clearance | 20mm |
| Transport speed | 1200밀리미터/초(맥스) |
| Transport height | 900±40mm |
| PCB clamping system | Clamping on both sides |
| Field of View (FOV) | 12mm x12mm |
| axis positioning accuracy | X Y:±20um@3σ; 지:±10um@3σ |
| 위치 정확도 | XY:±10.0μm @3σ; 지:±5um@3 σ |
| Maximum acceleration | 1200밀리미터/초 (X /Y) |
| Drive system | Servo +motor (X Y Z) |
| 공기의 압력 | 0.5-0.8MPa |
| 차원 | L1400*W1400*H1450mm |
| 무게 | 800킬로그램 |
| 힘 | 220V 50/60Hz, 8에이 |














