Oxford 700 Series Copper Thickness Measuring Instrument CMI700

CMI700: Integrated measurement of the thickness of hole copper and surface copper, convenient and cost-effective

Description

Product Features:

  1. Integrated measurement of the thickness of hole copper and surface copper, convenient and cost-effective
  2. Two methods, micro resistance and eddy current, are used to accurately measure the thickness of surface copper and hole copper
  3. The measurement system has high versatility and scalability, and its compatibility with multiple probes meets various application requirements, including surface copper, hole copper. At the same time, CMI700 has advanced statistical functions for organizing and analyzing test data.
  4. The SRP-4 series probes apply advanced micro resistance testing technology. When measuring, the thickness value can be accurately and reliably obtained by the function relationship between the thickness value and the resistance value, without being affected by the thickness of the insulation board layer or the copper layer on the back of the printed circuit board. The SRP-4 probe, which can be replaced by users themselves, is a patented product of Oxford Instruments. The lost probe can be quickly and easily replaced on site, reducing downtime. Replacing the probe module is far more economical than replacing the entire probe.

 

The CMI 700 configuration includes:

CMI 700 machine and certificate

SRP-4 probe

SRP-4 probe replacement probe module (1 unit)

NIST certified calibration standards and certificates

Optional accessory: ETP hole copper probe

 

Technical parameters for RP-4 surface copper probe:

Copper thickness measurement range:

Chemical copper: 10 μ in -500 μ in (0.25 μ m -12.7 μ m)

Electroplated copper: 0.1 mil-6 mil (2.5 μ m-152 μ m)

Linear copper testable line width range: 8 mil-250 mil (203 μ m -6350 μ m)

Accuracy: ± 1% (± 0.1 μ m) reference standard coupon

Precision: Chemical copper: Standard deviation 0.2%; Electroplated copper: standard deviation of 0.5%

Resolution: 0.01 mils ≥ 1 mil, 0.001 mils<1 mil,

0.1μm≥10μm, 0.01μm < 10μm, 0.001μm < 1μm

 

Technical parameters for ETP hole copper probe :

Tested minimum hole diameter: 35 mils (899 μ m)

Measurement thickness range: 0.08-4.0 mils (1-102 μ m)

Eddy current principle: comply with the relevant provisions of ASTM-E376-96 standard

Accuracy: ± 0.01 mil (0.25 μ m), when <1 mil (25 μ m)

Accuracy: 1.0% achieved at 1.2 mil (30 μ m) under laboratory conditions

Resolution: 0.01 mils

  • Display 6-digit LCD digital display;
  • Measurement unit um / mil optional;
  • Statistical data mean, standard deviation, value max, minimum value;
  • Interface 232 serial port, printing parallel port
  • Power AC220;
  • Instrument size 290x270x140mm;
  • Instrument weight 2.79kg;