자동 두 구성 요소 접착제 포팅 머신 TGP-3

Potting and encapsulation is the process of embedding products & assemblies in a liquid resin (potting compounds) to protect them against rough environment conditions. Potting can be performed in atmosphere pressure or even under vacuum, if high voltage insulation and high temperature differences are needed. Encapsulation of parts will stop corrosion of metals and reduce damage caused by vibration and mechanical stress.

The fully automatic glue Potting machine is generally used for AB two-component glue. It uses a precision gear metering pump or screw pump to measure, extract and mix according to the specified proportion, and drips, coatings, and seals the liquid on the surface or inside the product. It is an automated machine that achieves sealing, fixation, waterproofing, and other functions.

We offer automatic ,semi automatic fluid dispensing potting machine and the related production line and vacuuming systems. Compound materials A & B are kept in two tanks separately. There are two sets of metering pumps inside the machine for metering A and B resin by setting ratio, draining out material individually from tank A & B. Liquid A & B mix with each other in the mixer pipe and dispensed out according to the programmable data.

기술적 특징

• 5.7 inch touch screen operation, can be paired with computer operation software, can read CAD drawings, can operate on a single machine, easy to learn and understand;
• It has functions such as continuous interpolation of points, lines, surfaces, arcs, circles, irregular curves, and three-axis linkage, and can adapt to any irregular object gluing;
• The hard drive has a large storage memory capacity, unlimited program storage, no need for reprogramming, and the software has functions such as area array and translation and rotation operations;
• The glue quantity, thickness, coating speed, dispensing time, and stopping time can all be set as parameters, and the glue output is stable without leaking or dripping;
• Integrated implementation of three functions: 분배, Potting, and trajectory sealing, with fully automatic operation;
• According to the required ratio, achieve mixing while pouring glue, and save glue to the maximum extent;
• Store A glue and B glue separately to ensure that the glue does not solidify when left for a long time;
• Dynamic or static mixing can be used to achieve uniform and thorough mixing;
• Unique control system that is not affected by air pressure, avoiding uneven dispensing, wire drawing, bubbles, and other phenomena;
• The Z-axis height adjustment device can adapt to workpiece operations at different heights;
• Optional glue mixing, heating, and reserved vacuum defoaming function, suitable for different types of infusion processes.

Applicable glue:

Silicone， EMI conductive adhesive， UV glue， AB adhesive, quick drying adhesive, epoxy adhesive, sealant, red adhesive EPOXY (black glue), white glue, silver glue, heat dissipation paste, solder paste, transparent paint, screw fixing agent and so on.

애플리케이션:

• Potting&Encapsulation &Casting: electronics components , PCB, Capacitor, 전원 공급 장치, transformer, ignition coil, reverse sensor, circuit board, filter products ,underwater parts, electronic ballast ,aviation parts, aerospace parts….
• 디스펜싱&Dosing : LED strip , led lamp , led bulb , aluminum,led screen , display module ,medical parts,medical liquid filling ….
• Bonding&doming : LCD screen ,LOCA bonding,ABS plastic,different types of stickers , badge , keychains , souvenirs ,arts , photo frame , and other arts graphics….