Flexible and Rigid-flex PRINTED CIRCUIT BOARDS

Flex PCB, also known as FPC (flexible printed circuit board), is a circuit board which utilizes plastic substrates, like polyimide or polyester films, to create a flexibly and durable material for assembling components. FPC can be connection points or the primary control board of a PCB assembly.

Rigid-Flex PCB combines the features of rigid and flexible into one PCB. The rigid portion provides durability and the flexible section provides light weight a thin profile for various applications.

Description

Flexible Printed Circuit (FPC)

Flexible printed circuit consists of conducting layers made of copper foil and insulating layers dielectric that are typically laminate together with polyimide / PET / PEN / Liquid Crystal Polymer (LCP).

The board is used as a substrate for assembling electronics devices and can be bent for specific applications.

Single Side FPC

  • Consists of a single conductor layer of metal or conductive polymer on a flexible dielectric film.
  • Component termination features are accessible only from one side, with holes in the base film for component assembly.

Double Side FPC

  • Consists of 2 conductive layers fabricated with or without plated through holes.
  • When constructed without plated through hole, the connection features are accessible only from one side.
  • Because of the plated through hole, terminators for electronics components are provided on both sides of the circuit, allowing components to be placed on either side.

Multi Layered Flex Circuit

  • Consists of 3 or more layers of conductive and are also known as multilayer flex circuit.
  • Layers are interconnected by plated through hole or openings to access lower circuit level features.
  • Discontinuous lamination is common in cases that require maximum flexibility or bending.

Bare Backed Flex Circuit

  • Bare Back Flex Circuit (double access) has a single conductor layer that allows access to features of the conductor pattern such as lead termination from both sides.
  • This is not commonly manufactured because of the special processing required to provide access to the features discretely.

Rigid Flex Circuit

  • Hybrid constructions consists of flexible and rigid substrates are laminated together into a single structure and then electrically interconnected using plated through hole.

We build thousands of different products for our customers across a wide range of technologies and applications.

Our technology capability covers over 90% of all PCB technologies. Simply stated, we can build almost any PCB well. Please refer to parameters

Surface Finishes

Excellent Quality

  • Incoming Quality Control

We use raw materials from famous brands, have established incoming material inspection regulations that comply with international and customer standards, constantly trace and promote supplier quality improvement activities, and build and maintain strong cooperation with suppliers.

  • Process quality control

Standardized production process and detailed operation instructions for each process of the production line to ensure that the operation specifications and operation standards are correctly implemented.

  • Finished product quality control

We strictly check and control the shipment quality according to the international standards and customer standards, timely follow up the product quality performance after shipment, and take quick and effective improvement actions on the customer

ITEM Specification Comments
Layer counts Flexible PCB 1-10 Layers
Rigid-Flex PCB 2-16 Layers
HDI PCB 2+N+2 Layers
Copper Thickness 6um min
4OZ max
PNL Size(maximum) 610*914mm
Hole Diameter Laser drilling 0.05mm min
Mechanical drilling 0.15mm min
Hard tooling Hole 0.50mm
Aspect Ratio(maximum) Through hole 10:1
Blind hole 2:1
Line (minimum) 1/3oz Copper 1.2mil LDI
0.5oz Copper 1.5mil
0.5oz Copper 2mil Film exposure
1oz Copper 3mil
2oz Copper 4mil
Dimension&Tolerances Hole Size ±0.05mm H≦2.0mm
Line ±10% W≧0.25mm
Accumulate tolerance ±0.05mm W<0.25mm
Line to outline ±0.05mm P≦25mm
Outline tolerance ±0.05mm C≦5.0mm
Impedance tolerance ±10%
Connectivity test Resistance(minimum) 0.5mΩ Four lines
Resistance(minimum) Ordinary
Insulation Resistance 50MΩ Ordinary