RIGID PRINTED CIRCUIT BOARDS

Rigid circuit board is the most common and primary electronic component to a PCB assembly. Rigid PCB can be manufactured into single layer, double layers and multi-layer designs. There are also a wide range of materials which they can be manufactured with low cost to high technology.

Availbe for Production Order, Hot Order, Qucik Turn PCBS: Small volume prototype, Quick-turn pre-production circuit boards,Production quick-turn circuit boards

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Description

Rigid PCB

Rigid PCB circuit consists of conducting layers made of copper foil and insulating layers dielectric that are typically laminated together with epoxy resin prepreg. The board is typically coated with solder mask.

 

We build thousands of different products for our customers across a wide range of technologies and applications.

 

Our technology capability covers over 90% of all PCB technologies. Simply stated, we can build almost any PCB well.

Surface Finishes

 

Excellent Quality

  • Incoming Quality Control

We use raw materials from famous brands, have established incoming material inspection regulations that comply with international and customer standards, constantly trace and promote supplier quality improvement activities, and build and maintain strong cooperation with suppliers.

  • Process quality control

Standardized production process and detailed operation instructions for each process of the production line to ensure that the operation specifications and operation standards are correctly implemented.

  • Finished product quality control

We strictly check and control the shipment quality according to the international standards and customer standards, timely follow up the product quality performance after shipment, and take quick and effective improvement actions on the customer

Feature Parameter
Layers 1 – 36L
Max Board Size 580 x 1080mm, advanced 610 x 1400mm
Board Thickness Range 0.40 – 7.0mm
Copper weight 18 – 210μm, advanced 1050μm / 30oz
Min Line Width /Space 2.5 mil / 2.5 mil
Minimum mechanical drill 0.20 mm
Minimum laser drill 0.10mm standard, 0.075mm advanced
PTH Wall Thickness 1 mil
PTH Dia. Tolerance ± 3 mil
NPTH hole Dia. Tolerance ± 2 mil
Hole Position Deviation ±2 mil
Layer Registration ≥ 4mil
Outline Tolerance ± 4 mil
S/M Pitch 3 mil
Aspect Ratio 18:1
Warp & Twist ≤0.7%
Solder Mask Abrasion ≥ 6H
Flammability 94V-0
Impedance Control Diff >50ohm +/- 10%
Single-end ≤50 ohm +/- 8%
HDI Capability Any Layer
Dimple 20um, 10um advanced
Back Drill Size min 0.40mm
Special Technology POFV Yes
Hybrid Lamination Yes
Metallized half hole Yes