Machine à souder à la vague GT 300

Features of Machine à souder à la vague GT300 :

• Fully titanium solder pot & wave nozzles provide longer lifetime and excellent heat uniformity
• Exclusive design to reduce less solder dross
• Patented design of impeller & channel for improving soldering wave stability
• Solder pot preheating automatic starting system
• Flux level sensor and alarm system
• Flux adding automatic system (option)
• 3 bottom hot air preheating zones provide more stable preheating temperature
• Convenience for maintenance, easy to change preheater and air blower motor
• Finger cleaning system (brush & alcohol)
• Heavy duty finger transport system(option)
• Windows 7/10 OS assorted with intellectronics design, most convenience to operate

Modularize preheating system

Hot air circulation preheating module provides a stable preheating temperature

Modularize solder pot

• Standard solder pot, suitable different models and PCB size
• Manually solder pot in/out & up/down

Fully Titanium solder pot and wave nozzles

• No easy to deform when heating
• Well contact with heater for more uniform heating
• Lifetime over 10 years

Solder residue is limited < 0.4kg per hour. Cost saved by better utilization.

The oxidation reducing cover effectively control the wave flowing speed, lower the falling height and eliminate oxide

Solder residue should be removed everyday

The structure of channel and impeller directly influence the soldering wave stability The variation of wave level can be controlled within 0.5mm to ensure good welding.

The impeller design can convert the energy to solder pot constantly for forming more stable solder wave

The channel design optimize the interference between solder wave (more stable) Rectifier make the peak of wave more flat.

Cooling fans cooling system

Air cooling from up and down:

Forced air cooling system, can meet lead-free work art of cooling slope requirement

PC+PLC intelligent control system can be stable and reliable, repeat higher accuracy

Soldering Pot (Nitrogen control) (Possibilités): Partial nitrogen charging device for solder pot

• Stainless steel porous pipe sprays nitrogen evenly and stably
• Nitrogen will be blocked below the PCB and from a low oxygen layer between the PCB and the solder pot surface in order to achieve high welding quality and low oxidation.
• Since it is not closed area, oxygen analyzer cannot be installed

Field feedback for wave soldering with N2

Short-circuit and incomplete weld are reduced.

PCB surface is clean and smooth, without oxidation, and few solid residues.

The welding spot is bright, clean, without oxidation and few flux residues.

The flux residues is largely reduced, compared with welding under air and the PCB has little adhesion.

In addition, the welding spot strength will be enhanced in principle, reducing return to factory repair and the machine using life will be prolonged.

Reducing solder dross amount by Nitrogen:

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